· Resistant to moisture, UV, and temperature changes

 · High strength to improve flatness and splicing 

 · Reducing glare for better contrast

 · Advanced pad bonding with high stability

 · PC+30 fiber bottom case kit, ensuring robustness and flatness

 · High-grade ICs with a broader color spectrum and evenly-divided gray scales

 · PCB design, optimizing performance

 · Cut-edge modules ensure no extra cuts or seams for curved displays

 · Extended splicing angles: splice the display outward from 90 to 180 degrees

 · Splicing with 120-degree flexibility for both concave and convex bending

 · Magnetic column improves the stability of installation